WT5921-32T Thermal Gel, a new gel-like thermally conductive interface material made of silicone composite thermally conductive filler material, is changing the way heat dissipation operates in modern electronic devices - can be used in T1.

Can be used T1, that is, this thermal gel can be used in the TIM1 chip interface thermal conductivity, thermal conductivity in the chip package, so that the chip "factory with" thermal conductive gel. This product is a silicone resin as a substrate, while adding a certain proportion of special particle size control and with the thermal filler, interface treatment agent and dispersant, and through a special process into the thermal gel.

In thermal management applications, it can provide excellent thermal conductivity at a minimum thickness state of 0.02mm after being pressurized. It also has good shear thinning properties and can form a uniform thin layer under pressure, which is mainly used as a thermal conductor at the TIM1 in-chip interface and as a TIM2 between the heat sink and the heat source to provide heat transfer in a tiny space.

In terms of scientific and technological innovation, WT5921-32T Thermal Conductive Gel is another manifestation of technological change of life, which adopts advanced composite thermal conductive filling technology, combining the advantages of silicone resin and advanced material science to create a brand new material with both high thermal conductivity and excellent mechanical properties, which not only improves the heat dissipation efficiency of the electronic equipment, but also greatly extends the service life of the equipment.